As a special theme for SILM 2023, we solicit submissions that present novel research that develops or relies on hardware/software interfaces to improve security and dependability in the telecommunications sector. In particular, work that aims at 5G, edge and cloud scenarios where strict requirements on bandwidth, latency, and availability need to be met, are of special interest for SILM this year. Submissions must be within the general scope of SILM 2023 as stated below.
Topics of interest include, but are not limited to the following:
We accept two categories of submissions:
All papers must be written in English and describe original work that has not been published or submitted elsewhere. The submission category (regular paper, short paper, special theme) should be clearly indicated. All submissions will be fully reviewed by members of the Program Committee. Papers will appear in IEEE Xplore in a companion volume to the regular EuroS&P proceedings. Contact the Program Chairs if you do *not* want your *short paper* to appear in the proceedings.
Papers must be typeset in LaTeX in A4 format (not “US Letter”) using the IEEE conference proceeding template we provide: eurosp-2023-template.zip We suggest you first compile the supplied LaTeX source as is, checking that you obtain the same PDF as the one supplied, and then write your paper into the LaTeX template, replacing the boilerplate text. Please do not use other IEEE templates. Failure to adhere to the page limit and formatting requirements can be grounds for rejection.
For accepted papers, at least one author must attend the workshop.